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| Apparatus | Vacuum oven |
| Supplier | Heraeus |
| Function | Vacuum annealing |
| Main purpose | Annealing of photoresist by heating in vacuum |
| Main Characteristics | Pressure 1.10-2 mbar Themperature up to 300 °C |
| Facilities | Nitrogen flow possible |
| Typical application | Backing of photoresist |
| Specimen | 100 mm wafers and other substrates |
| Apparatus | Wetbench |
| Supplier | ECP |
| Function | Coating resist |
| Main purpose | Pre-conditioning substrates and photoresist deposition |
| Main Characteristics | HNO3 pre-cleaning BHF dip Ultrasonic cleaning Wafer scribing/breaking Resist Spinner 2 Hot plates Lift-off |
| Specimen | 100 mm wafers and other substrates |