FononTech: revolutionary printing technology for microelectronics assembly
The rapidly shrinking size of components in consumer electronics makes it increasingly difficult to manufacture connections between them. This is the domain of ‘advanced packaging’: connecting chips in a 3D structure at micrometre scale. At Holst Centre, TNO has developed a revolutionary method to do just that at super-high speed. International manufacturers are already lining up to take advantage of this development.
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HERACLES lays foundation for secure data sharing in healthcare sector
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