Dr Rob Willekers
- Space Systems Engineering
Due to the ever increasing metrology requirements for 1X nm node fabrication, measurements of sub-10 nm defects are required and recognized as one of the challenges for blank and patterned wafers and masks. These metrology requirements are not yet being appropriately met by existing techniques, since they are already performing at the edge of their performance.
Scanning probe microscopy (SPM) has been suggested as one of the technologies that can fulfil the future metrology and inspection requirements, because it has the distinct advantage of being able to discern in 3D the atomic structure of the substrate. TNO has an excellent technology which enables operation of many miniaturized SPM heads on a relatively large sample, such as a wafer or mask which enables a ground breaking increase in SPM throughput.
In electronics
In metrology
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