CITC becomes part of TNO: boost for chip packaging in Nijmegen

‘In the coming years, TNO aims to play a key role in the development of advanced chip packaging in the Netherlands,’ says Arnaud de Jong, Director of High Tech Industry at TNO. ‘By integrating CITC into TNO, we can intensify and expand our research efforts. Moreover, we contribute to the further development of Lifeport in Nijmegen as a strong, future-proof semiconductor ecosystem.’ With the investment in CITC, TNO connects chip technology activities between Nijmegen and other semiconductor hubs such as Eindhoven.

Advanced chip packaging

CITC was founded in 2019 by TNO, TU Delft, and others as an independent innovation center for advanced chip packaging technology. Within an ecosystem of companies, research institutions, and educational organizations, CITC has developed into a broad R&D hub collaborating on technological breakthroughs in advanced chip packaging.

‘The integration of CITC into TNO marks an important milestone for CITC. This step highlights our shared vision for the future of chip integration and packaging technology,’ says Jeroen van den Brand, General Manager of CITC in Nijmegen. ‘It creates room for growth, accelerates innovation, and strengthens CITC’s international position as a center of expertise for semiconductor and photonic packaging.’

Strategic choice for Nijmegen

The integration of CITC into TNO will be formalized on January 1, 2026. CITC will become part of TNO’s High Tech Industry business unit and will remain located at the Noviotech Campus in Nijmegen. Toni Versluijs, Chair of the CITC Supervisory Board: ‘CITC continues on its current path. For the Supervisory Board, it is essential that with TNO’s ambition and investment, we build on existing talent and technology and give CITC the space to grow further.’

Lucas van Vliet, representing TU Delft on the CITC Supervisory Board: ‘The collaboration between TU Delft and TNO within CITC will change in form as of January 1, but remains equally strong. TU Delft believes in the importance and growth potential of chip packaging and sees the integration of CITC into a strong organization like TNO as an opportunity to further accelerate innovation in chip technology.’