High Tech Industry

FononTech: revolutionary printing technology for microelectronics assembly

The rapidly shrinking size of components in consumer electronics makes it increasingly difficult to manufacture connections between them. This is the domain of ‘advanced packaging’: connecting chips in a 3D structure at micrometre scale. At Holst Centre, TNO has developed a revolutionary method to do just that at super-high speed. International manufacturers are already lining up to take advantage of this development.

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HERACLES lays foundation for secure data sharing in healthcare sector

8 February 2024
In the HERACLES project, we use secure data exchange for cancer research. This lays the foundation for the care of the future.