TNO and ASML join forces to scale European photonic chip manufacturing

Scaling integrated photonics

By aligning their technical expertise, the parties aim to enable scalable, high-volume manufacturing of photonic chips through lithography, process control, and metrology solutions. The partnership involves a phased approach where ASML utilizes lithography equipment, including DUV and I-Line scanners, within the pilot line facility. This shared R&D environment facilitates technical workshops and joint innovation activities, allowing ASML to leverage TNO’s infrastructure for internal development and customer demonstrations.

Strengthening European high-tech

Once operational, the fab will facilitate full-scale manufacturing of advanced Indium Phosphide (InP) photonic chips at a 6-inch wafer scale. Beyond physical manufacturing, the research ecosystem is already primed to leverage these advancements. TNO, Eindhoven University of Technology, and the University of Twente are working together within the jointly founded Photonic Integration Technology Centre (PITC) to turn innovative designs into real-world applications. This new structured collaboration with ASML is designed to improve operational performance and ensure Europe remains a global leader in the rapidly evolving integrated photonics landscape.

Arnaud de Jong, Managing Director TNO High Tech Industry, says: ‘This partnership with ASML reinforces our commitment to building European unicorns in the semiconductor landscape. By combining our R&D capabilities with world-class equipment, we are creating a unique pilot-line environment that will benefit the entire industry.’

Stanislas Baron, Senior Vice President at ASML added: ‘Scaling photonic chip technology requires a seamless transition from cutting-edge research to high-volume manufacturing. By integrating our lithography systems into TNO’s pilot line, we are bridging that gap. This collaboration gives us the ideal environment to optimize our processes for integrated photonics, ultimately accelerating the time-to-market for this transformative technology.’