The invisible revolution in electronics and the opportunities for Europe

The rapid growth of AI and advanced computing technologies is creating demand for a new generation of electronic systems that go beyond traditional chip-centric architectures. By combining advanced packaging technologies, integrated photonics, and Beyond PCB integration at industrial scale, Europe can secure critical strategic capabilities and take a leading role in building a future-proof AI infrastructure.

Vision paper Future Electronics (pdf, 807 kB)

From chip-centric industrial policy towards systems-oriented strategy

By 2035, electronics will no longer evolve primarily through the addition of more connected devices. Instead, it will become an invisible, intelligent layer embedded throughout the physical world.

As strategic control within the electronics sector shifts, Europe and the Netherlands must move from a chip-centric industrial policy towards a systems-oriented strategy. This is not a policy choice but a technical necessity: AI workloads are pushing electrical interconnections to their limits, causing system complexity to move increasingly from printed circuit boards to tightly integrated architectures.

This paper focuses on three converging solutions: advanced packaging technologies, integrated photonics, and Beyond PCB technologies that embed electronics directly into materials, as well as the industrial roadmap required to secure Europe’s future position.

Read in the paper how:

Growing demand from AI and computing creates an opportunity to move from traditional chip-centric architectures to highly integrated, systems-oriented solutions.
Mastering the convergence of advanced packaging, integrated photonics, and Beyond PCB integration is key to unlocking this next generation of electronic systems.
By accelerating the industrial scaling of these technologies, Europe can secure critical control points and lead the development of future-proof AI infrastructure.

Download the vision paper (pdf, 807 kB)